PIIPM25P12B008
I27147 02 - Oct
The new package outline is show on page 4, all
signal and power pins are clearly listed, note that
because of high current spikes on those inputs the
DC bus power pins are doubled in size comparing
to the other power pins. Module technology uses
the standard and well know DBC: over a thick
Copper base an allumina (Al 2 O 3 ) substrate with a
300 μ m copper foil on both side is placed and
IGBTs and Diodes dies are directly soldered,
through screen printing process. These dies are
then bonded with a 15 mils aluminum wire for
power and signal connections. All components
are then completely covered by a silicone gel
with mechanical protection and electrical
isolation purposes.
T HE “EDB” E MBEDDED D RIVING B OARD
This is the core of the device intelligence, all
control and driving functions are implemented at
this level, the board finds its natural placement as
a cover of the module itself and has a double
function of mechanical cover and intelligent
interface. DSP and all other electronics are here
assembled; figure on page 2 shows the board
schematic and all connection pins.
Looking at the schematic, all diamond shaped
pins are signal connections, some belonging to
the RS422 port interface and some to the IEEE
1. DSP and opto isolated serial and JTAG
ports.
The DSP used in this application is the new
TMS320LF2406A from TI, it is a improvement
of the well known in the motor driver market
“F240” used in many motor driver applications. If
we compare this new device with the predecessor,
the new DSP has some added features that let the
software designer significantly improve the
system control performances, the following table
shows a list of relevant data, for all other
information please refer to the related device
datasheet. To be noted is the increased number of
instruction per second, (40MIPS) and of I/O pins,
the availability of a boot ROM and a CAN, a
much faster ADC and the reduced supply voltage
from 5V down to 3.3V, to follow the global trend
for this type of products. The choice of the DSP
has been done looking at the high number of
applications already existing in the market using
devices of this family, however it is clear that the
same kind of approach could be followed using
products from different suppliers to let the
customer work on its preferred and well known
platform.
TMS320LF2406A vs TMS320F240
1149.1 (JTAG) connector. All other pins are used
for communication between the board and the
module, they are positioned laterally in the board
and the module doesn’t have any pins in the
middle of its body.
From the top left, in anti-clockwise direction we
identify the following blocks that will be then
described in details:
MIPS
RAM
Flash
ROM
Boot ROM
Ext. Memory I/F
Event manager
? GP timers
? CMP/PWM
‘F2406
40
2.5Kw
32Kw
256w
Yes
4
10/16
‘F240
20
544w
16Kw
Yes
Yes
3
9/12
1.
2.
3.
4.
5.
DSP and opto isolated serial and JTAG ports
Flyback Power Supply
Current Sensing interfaces, over-current
protections and signal conditioning
Gate drivers
DC bus and Input voltage feedback
? CAP/QEP
Watchdog timer
10-bit ADC
? Channels
? Conv. time (min)
SPI
SCI
CAN
Digital I/O pins
Voltage range
6/4
Yes
Yes
16
500ns
Yes
Yes
Yes
37
3.3V
4/2
Yes
Yes
16
6.6 μ s
Yes
Yes
28
5V
www.irf.com
12
相关PDF资料
PK3020KB KIT KEYPAD, MOUSE, AND USB HUB
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PK3022ET KIT CAT5 CABLE MOUSE USB HUB
PKSERIAL-I2C1 BOARD DEMO PICKIT SERIAL I2C
PKSERIAL-SPI1 BOARD DEMO PICKIT SERIAL SPI
PL-BYTEBLASTER2N CABLE PROGRAMMING PARALLEL PORT
PL-MASTERBLASTER CABLE PROGRAMMING RS-232/USB
PL-USB-BLASTER-RB CABLE PROGRAMMING USB
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